Tianxing Du

Du completed his bachelor's degree in Microelectronics from University of Electronic Science and Technology of China in 2024. Then he started his master’s degree in Microelectronics from the faculty of EEMCS, Delft University of Technology. In February 2025, Du joined Electronics Components Technology and Materials (ECTM) group as a master student. His master thesis project is focused on advanced packaging of Photonics Integrated Circuits, cooperated with CITC (Chip Integration Technology Center) and Eindhoven University of Technology.

Program: MSc Microelectronics