Electronic Components, Technology and Materials
Department of Microelectronics

dr. L. Gu

Postdoc
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: RF linear varactor, MEMS and RF MEMS devices

Themes: MEMS Technology

Biography

Lei Gu received the B.S., M.S. and PhD degrees in electrical and electronic engineering from Southeast University, Nanjing, China, in 2001 and 2004,and the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China in 2007. respectively, and is currently working in TUDelft as a postdoc. His current research interest is about silicon-on-glass process and varactors fabricated with MEMS technology.

Publications

  1. A Review of Modification Methods of Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
    Dai, Hanqing; Chen, Yuanyuan; Xu, Wenqian; Hu, Zhe; Gu, Jing; Wei, Xian; Xie, Fengxian; Zhang, Wanlu; Wei, Wei; Guo, Ruiqian; Zhang, Guoqi;
    Energy Technology,
    Volume 9, Issue 1, pp. 2000682, 2021. DOI: 10.1002/ente.202000682
    document

  2. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  3. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
    Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
    In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807

  4. Effective Approaches of Improving the Performance of Chalcogenide Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
    Dai, Hanqing; Xu, Wenqian; Hu, Zhe; Chen, Yuanyuan; Wei, Xian; Yang, Bobo; Chen, Zhihao; Gu, Jing; Yang, Dan; Xie, Fengxian; Zhang, Wanlu; Guo, Ruiqian; Zhang, Guoqi; Wei, Wei;
    Frontiers in Energy Research,
    Volume 8, pp. 97, 2020. DOI: 10.3389/fenrg.2020.00097
    document

  5. Design rules for Patterning in Deep Cavities Formed by TMAH-etching of Si
    Lei Gu; Wim Wien; Lis. K. Nanver;
    In Proc. 11th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE),
    Veldhoven, The Netherlands, Nov. 2008.

  6. A new approach in measuring Cu-EMC adhesion strength by AFM
    C. K. Y. Wong; H. Gu; B. Xu; M. M. F. Yuen;
    IEEE Transactions on Components and Packaging Technologies,
    Volume 29, pp. 543-550, 2006.

  7. Study on thermal interface material with carbon nanotubes and carbon black in high-brightness LED packaging with flip-chip technology
    K. Zhang; G. W. Xiao; C. K. Y. Wong; H. W. Gu; M. M. F. Yuen; P. C. H. Chan; B. Xu;
    In Proceedings-Electronic Components and Technology Conference,
    Lake Buena Vista, FL, pp. 60-65, 2005.

  8. A new approach in measuring Cu-EMC adhesion strength by AFM
    C. K. Y. Wong; H. Gu; B. Xu; M. M. F. Yuen;
    In Proceedings-Electronic Components and Technology Conference,
    Las Vegas, NV, pp. 491-495, 2004.

  9. X-ray scattering from a rough surface and damaged layer of polished wafer
    M. Li; Z.H. Mai; S.F. Cui; J.H. Li; Y.S. Gu; Y.T. Wang; Y. Zhuang;
    J. Phys. D,
    Volume 27, Issue 9, pp. 1929, 1994.

  10. Determination of surface roughness of InP (001) wafers by x-ray scattering
    S.F. Cui; J.H. Li; M. Li; C.R. Li; Y.S. Gu; Z.H. Mai; Y. ZY. Huang.T. Wang;
    J. Appl. Phys.,
    Volume 76, Issue 7, pp. 4154, 1994.

BibTeX support

Last updated: 16 Jun 2014

Lei Gu

Alumnus