MSc Lin

1. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
   Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
   IEEE Transactions on Power Electronics,
   Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

2. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
   Lin, P.; Xie, X.; Wang, Y.; Lian, B.; GuoQi Zhang;
   Microsystem Technologies,
   2019. DOI: 10.1007/s00542-018-4249-8

3. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
   Fengze Hou; Wang, W.; Zhang, H.; Chen, C.; Chen, C.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
   Applied Thermal Engineering,
   Volume 163, pp. 114338, 2019. DOI: 10.1016/j.applthermaleng.2019.1143

4. Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
   Jian Zhang; Robert Sokolovskij; Ganhui Chen; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Wenmao Li; GuoQi Zhang; Yu-Long Jiang; Hongyu Yu;
   Sensors and Actuators, B: Chemical,
   Volume 280, pp. 138-143, 2019. DOI: 10.1016/j.snb.2018.10.052

5. Characterization of PCB Embedded Package Materials for SiC MOSFETs
   Fengze Hou; Wang, W.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
   IEEE Transactions on Components, Packaging and Manufacturing Technology,
   Volume 9, Issue 6, pp. 1054-1061, 2019. DOI: 10.1109/TCPMT.2019.2904533

6. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
   Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
   In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
   pp. 1365- 1370, 2018.

7. Au-based and Au-free Ohmic Contacts to AlGaN/GaN Structures on Silicon or Sapphire Substrates
   Wenmao Li; Jian Zhang; Robert Sokolovskij; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Jingyi Wu; Lingli Jiang; Hongyu Yu;
   In 18th International Workshop on Junction Technology,
   2018.

8. Compensation Method for Die Shift in Fan-Out Packaging
   Yue Sun; Fengze Hou; Chen, F.; Liu, H.; Zhang, H.; Sun, P.; Lin, T.; Cao, L.;
   In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
   2018. DOI: 10.1109/ICEPT.2018.8480551

9. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
   Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
   IEEE Transactions on Components, Packaging and Manufacturing Technology,
   Volume 7, Issue 10, pp. 1721-1728, 2017.

10. A Monolithic Low-Distortion Low-Loss Silicon-on-Glass Varactor-Tuned Filter With Optimized Biasing
    K. Buisman; L. C. N. de Vreede; L. E. Larson; M. Spirito; A. Akhnoukh; Y. Lin; X. Liu; L. K. Nanver;
    IEEE Microwave and Wireless Components Letters,
    Volume 17, Issue 1, pp. 58-60, Jan. 2007.

11. Adaptive Multi-Band Multi-mode power amplifier using integrated varactor-based tunable matching networks
    W. C. E. Neo; Y. Lin; X.-D. Liu; L. C. N. de Vreede; L. E. Larson; M. Spirito; M. J. Pelk; K. Buisman; A. Akhoukh; A. De Graauw; L. K. Nanver;
    IEEE Journal of Solid-State Circuits,
    Volume 41, Issue 9, pp. 2166-2176, Sept. 2006. ISSN 0018-9200.

12. Low-distortion, low-loss varactor-based adaptive matching networks, implemented in a silicon-on-glass technology
    K. Buisman; L.C.N de Vreede; L.E. Larson; M. Spirito; A. Akhnoukh; Y. Lin; X. Liu; L.K. Nanver;
    In Proc. IEEE Radio Frequency Integrated Circuits Symposium,
    pp. 389-392, 2005.
    document

13. Improved hybrid SiGe HBT class-AB power amplifier efficiency using varactor-based tunable matching networks
    W. C. E Neo; X. Liu; Y. Lin; L. C. N. de Vreede; M. Spirito; A. Akhnoukh; L. K. Nanver; L. E. Larson; A. de Graauw;
    In Proc. IEEE Bipolar/BiCMOS Circuits and Technology Meeting BCTM,
    pp. 108-111, 2005.

14. Investigation of periodicity fluctuations in strained (GaNAs)1/(GaAs)m superlattices by the kinematical simulation of X-ray diffraction
    Z. Pan; Y.T. Wang; Y. ZY. Huang. W. Lin; Z.Q. Zhou; L.H. R. LiH. Wu; Q.M. Wang;
    Applied Physics Letter,
    Volume 75, Issue 2, pp. 223, 1999.

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