dr.ir. Yi

1. Through Package Via: A bottom-up approach
   H. Yi;
   PhD thesis, Delft University Technology, 2020.
   document

2. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater
   Jianwen Sun; Teng Zhan; Zewen Liu; Junxi Wang; Xiaoyan Yi; Lina Sarro; GuoQi Zhang;
   Optics Express,
   Volume 27, Issue 25, 2019.
   document

3. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
   H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
   ETV Maxwell,
   Volume 21.2, 2018.

4. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
   Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
   Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

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