dr. Zhen Cui

1. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
   Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
   Journal of the Mechanics and Physics of Solids,
   Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257

2. Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
   Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
   Journal of the Mechanics and Physics of Solids,
   Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256

3. Effect of Thermomigration on Electromigration in SWEAT Structures
   Zhen Cui; Xuejun Fan; GuoQi Zhang;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100774

4. Electromigration-induced local dewetting in Cu films
   Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
   In Proc. of the IEEE International Interconnect Technology Conference,
   2023. DOI: 10.1109/IITC/MAM57687.2023.10154761

5. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
   Xuejun Fan; Zhen Cui; GuoQi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

6. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
   Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
   Journal of Physics: Condensed Matter,
   Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

7. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
   Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   Corrosion Science,
   pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

8. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
   Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
   Journal of Physical Chemistry C,
   2021.
   document

9. Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment
   Zhen Cui;
   PhD thesis, Delft University Technology, 2021.
   document

10. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: 10.1016/j.apsusc.2020.145251

11. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

12. Implementation of General Coupling Model of Electromigration in ANSYS
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    In IEEE 70th Electronic Components and Technology Conference (ECTC),
    2020.
    document

13. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
    Journal of Luminescence,
    Volume 219, pp. 116874, 2019. DOI: 10.1016/j.jlumin.2019.116874
    document

14. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
    Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; GuoQi Zhang; Rong Sun; Chingping Wong;
    ACS Applied Materials & Interfaces,
    2019.

15. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019. DOI: 10.1063/1.5065376

16. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

17. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
    Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
    In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
    2018. DOI: 10.1109/EDTM.2018.8421434

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