dr. Hao Zhang

1. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
   Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
   IEEE Transactions on Components, Packaging and Manufacturing Technology,
   2019. DOI: 10.1109/TCPMT.2018.2884032

2. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
   Ruisheng Xu; Yang Liu; Hao Zhang; Zhao Li; Fenglian Sun; GuoQi Zhang;
   Journal of Electronic Materials,
   Volume 48, Issue 3, pp. 1758-1765, 2019. DOI: 10.1007/s11664-018-06865-1

3. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
   Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
   Soldering and Surface Mount Technology,
   2019. DOI: 10.1108/SSMT-01-2018-0005

4. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
   Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
   Results in Physics,
   Volume 12, pp. 712-717, 2019. DOI: 10.1016/j.rinp.2018.12.026

5. Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics
   Hao Zhang;
   PhD thesis, Delft University of Technology, 2019.
   document

6. A new hermetic sealing method for ceramic package using nanosilver sintering technology
   Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
   Microelectronics Reliability,
   Volume 81, pp. 143-149, 2018.

7. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
   Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
   IEEE Transactions on Device and Materials Reliability,
   Volume 18, Issue 2, pp. 240-246, 2018.

8. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
   Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
   IEEE Transactions on Components, Packaging and Manufacturing Technology,
   Volume 8, Issue 7, pp. 1254-1262, 2018.

9. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
   Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
   Results in Physics,
   2018. DOI: 10.1016/j.rinp.2018.10.005

10. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
    Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    pp. 13167-13175, 2018. DOI: 10.1007/s10854-018-9440-2

11. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

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