Electronic Components, Technology and Materials
Department of Microelectronics

dr. Xu Liu

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Jan 2023): Pressure-assisted Cu sintering for SiC Die-attachment application
Promotor: GuoQi Zhang

Expertise: Power electronics packaging, metal/ceramic materials

Themes: Micro/Nano System Integration and Reliability

Biography

Xu Liu received his bachelor's degree in Materials Physics in 2015 at University of Science and Technology Beijing (USTB). Then he started his master program in RWTH Aachen University in Germany majored in Material Science and Engineering. Since October 2018, he has joined ECTM in TU Delft as a PhD student. His current work is focusing on metal-ceramic substrate applied in power electronics packaging.

Projects history

Solid State Lighting reliability for automotive application

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

  3. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  4. Pressure-assisted Cu sintering for SiC Die-attachment application
    Xu Liu;
    PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8

  5. Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
    X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739

  6. A DFT Model Study about Structure Sensitivity for Benzotriazole Adsorption on Copper Surfaces and Nano Cluster
    Weihong Zhang; Quan Zhou; Honghao Tang; Xu Liu; Huaiyu Ye; Sau Wee Koh; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    Guangzhou, China, IEEE, pp. 1-4, Aug 2020. DOI: 10.1109/ICEPT50128.2020.9202975

  7. Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties
    Xu Liu; Quan Zhou; Qipeng Liu; Honghao Tang; Chenshan Gao; Bin Xie; Sau Wee Koh; Huaiyu Ye; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    pp. 1-5, 2020. DOI: 10.1109/ICEPT50128.2020.9201937

BibTeX support

Last updated: 30 Jan 2023

Xu Liu

Alumnus
  • Left in 2022