Tibbe van der Biezen

Backside contacting of individual signals in multilayer ICs for chip forensics.

It’s about making a prove of concept for a new method to access and reading out the signals on the deepest interconnects in chips.

Hi, my name is Tibbe van der Biezen, I am a master student Micro-electronics and as of September 2023 I will be joining the ECTM department. I did my bachelor in Electrical Engineering here at TU Delft and am now working on my master thesis regarding backside contacting of individual signals in multilayer ICs for chip forensics.                                                                                    

MSc thesis: Backside contacting of individual signals in multilayer ICs for chip forensics
Advisor(s): Sten Vollebregt

Program: MSc Microelectronics