MSc H.A. Henry Martin
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics Themes: Micro/Nano System Integration and Reliability
Biography
Henry Antony Martin obtained his MSc degree in Mechanical Engineering from TU Eindhoven in 2020. During his studies, he worked as a research intern at ASML for a period of 3 months. He worked at Philips for his master thesis research, which was focused on micromechanics background. His research was to understand the complex mud cracking fracture on Tungsten material which is being used in Philips X-ray tubes and also in International Thermo-nuclear Experimental Reactor (ITER).
Currently he is a PhD candidate in the Electronics Components Technology and Materials (ECTM) group in the department of Microelectronics at TU Delft. He has a solid background in Mechanical Engineering from TU Eindhoven and is specialized in Mechanics of Materials (MoM). His research is focused on Predictive reliability of power packaging which is in collaboration with Chip Integration Technology Center (CITC). He states that the next generation power electronic components will be smaller, faster, and more reliable, and he is working on novel concepts to improve the reliability of power packages.
Last updated: 21 Sep 2021
H.A. Henry Martin
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- Room: CITC
- List of publications