MSc Weiping Jiao

Weiping received his bachelor’s degree in Electronic science and technology from Jilin university in Changchun, China(2020). He completed a master’s degree in microelectronics at TU Delft(2022). During his bachelor study, he enjoyed learning mathematics and physics. In 2021, he joined Electronics Components Technology and Materials (ECTM) group for his master thesis project, which consists of new flip-chip bonding method development and nano particle sintering study. In 2023, Weiping joined TU Delft as a PhD candidate in ECTM. He is currently working on a joint project between ECTM and Boschman Advanced Packaging Technology. His research theme is about a new packaging method: through polymer via (TPV).

Last updated: 2 Nov 2023