dr. Jiaqi Tang

1. MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis
   Jiaqi Tang;
   PhD thesis, Delft University of Technology, 2014.
   document

2. Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
   Jiaqi Tang; D. Gruber; J.B.J. Schelen; H.-J. Funke; C.I.M. Beenakker;
   ECS Journal of Solid State Science and Technology,
   Volume 1, Issue 4, pp. P175-P178, Aug. 2012. DOI 10.1149/2.019204jss.

3. Flexible system for real-time plasma decapsulation of copper wire bonded IC packages
   Jiaqi Tang; J.B.J. Schelen; C.I.M. Beenakker;
   In 62nd IEEE Electronic Components and Technology Conference (ECTC 2012),
   San Diego, US, pp. 1764-1769, May 2012. ISBN 978-1-4673-1966-9; DOI 10.1109/ECTC.2012.6249076.

4. Plasma etching for failure analysis of integrated circuit packages
   Jiaqi Tang; J.B.J. Schelen; C.I.M. Beenakker;
   In ECS Transactions: China Semiconductor Technology International Conference 2011 (CSTIC 2011),
   Shanghai, China, pp. 913-918, Mar. 2011. ISSN 1938-5862; DOI 10.1149/1.3567691.

5. Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
   Jiaqi Tang; H. Ye; J.B.J. Schelen; C.I.M. Beenakker;
   In Proc. 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011),
   Shanghai, China, pp. 888-892, Aug. 2011. ISBN 978-1-4577-1768-0; DOI 10.1109/ICEPT.2011.6066972.

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